ESP32-WROOM-32D (30 pin)

I got this module from AliExpress from a here-today-gone-tomorrow vendor with the development board with Dupont sockets and screw-down blocks for each pin. Total of about $7 for the pair. It looks like a nice development setup that I won’t lose sleep if I bury the development board in the final device.

Pinout Notes

GPIOInputOutputNotes
0Pulled upOKOutputs PWM signal at boot, must be LOW to enter flashing mode, strapping pin.
1TX pinOKDebug output at boot
2OKOKConnected to on-board LED, must be left floating or LOW to enter flashing mode, strapping pin.
3OKRX pinHIGH at boot
4OKOK
5OKOKOutputs PWM signal at boot, strapping pin
12OKOKBoot fails if pulled high, strapping pin.
13OKOK
14OKOKOutputs PWM signal at boot
15OKOKOutputs PWM signal at boot, strapping pin
16OKOKLower output source current. Note 1 – DC Characteristics
17OKOKLower output source current. Note 1 – DC Characteristics
18OKOK
19OKOK
21OKOKDefault SDA.
22OKOKDefault SDL.
23OKOK
25OKOKAlso 8-bit DAC1.
26OKOKAlso 8-bit DAC2.
27OKOK
32OKOK
33OKOK
34OKInput only – No PUP/PUD
35OKInput only – No PUP/PUD
36OKInput only – No PUP/PUD
39OKInput only – No PUP/PUD

Typical Module Schematics

The actual ESP32 module may not uses the following schematics – but it should be pretty close. This schematic is specifically designed to support the WSP-32S (38 pin module). Just ignore the unsupported pins on your module.

Module Physical Layout

Strapping Pins

There are five pins that are required to be Hi-Z or open circuited when the ESP powers on (power-on-reset, RTC watchdog reset and brownout reset). Internally, the module uses internal pull-up and pull-down circuits to configure:

  • Voltage of Internal LDO (VDD_SDIO) is 3.3V. The module integrates a 3.3 V SPI flash, so the pin cannot be set to 1 when the module is powered up.
  • SPI Boot Mode
  • Enable Debugging Log Print over U0TXD During Booting (GPIO1)
  • Timing of SDIO Slave, RE Sampling, RE Output

CPU and Internal Memory

ESP32-D0WDQ6 contains two low-power Xtensa® 32-bit LX6 microprocessors. The internal memory includes:

  • 448 KB of ROM for booting and core functions.
  • 520 KB of on-chip SRAM for data and instructions.
  • 8KB of SRAM in RTC, which is called RTC FAST Memory and can be used for data storage; it is accessed by the main CPU during RTC Boot from the Deep-sleep mode.
  • 8KB of SRAM in RTC, which is called RTC SLOW Memory and can be accessed by the co-processor during the Deep-sleep mode.
  • 1Kbit of eFuse: 256 bits are used for the system (MAC address and chip configuration) and the remaining.
  • 768 bits are reserved for customer applications, including flash-encryption and chip-ID.

DC Characteristics

  • Cin (Pin capacitance): 2 pf (typ)
  • *** INPUT ***
  • VIH (High level input voltage): 0.75xVDD (min), VDD+0.3 (max), V
  • VIL (Low level input voltage): -0.3 (min), 0.25xVDD (max), V
  • IIH, IIL (High level, low level input current): 50 nA (max)
  • *** OUTPUT ***
  • VOH (High level output voltage): 0.8xVDD (min), V
  • VOL (Low level output voltage): 0.1xVDD (max), V
  • IOH (High level source current): 40 mA (typ)
  • IOH (High level source current, VDD_SDIO power domain): 20 mA (typ) Note 1
  • IOL (Low level sink current, output drive strength set to maximum): 28 mA (typ)

Note 1 Pins in the VDD_SDIO power domain are designed to deliver less source power. They are typically used to power built-in FLASH or PSRAM since the voltage must be correct for the ICs used. Pins are as follows:

  • GPIO16
  • GPIO17
  • Six others not exposed to external pins on this device.